CoWoS packaging

Software / App

Chip-on-Wafer-on-Substrate, TSMC's advanced packaging technology; mentioned as a potential bottleneck in the AI supply chain's ability to scale.

Mentioned in 1 video

Videos Mentioning CoWoS packaging

Jensen Huang: NVIDIA - The $4 Trillion Company & the AI Revolution | Lex Fridman Podcast #494

Jensen Huang: NVIDIA - The $4 Trillion Company & the AI Revolution | Lex Fridman Podcast #494

Lex Fridman

Chip-on-Wafer-on-Substrate, TSMC's advanced packaging technology; mentioned as a potential bottleneck in the AI supply chain's ability to scale.